Panel Size(FPC): |
Panel width:250mm*2(Pcs)/500mm Panel Length:350-500mm Panel Thickness:0.012mm(core)+12/12μm Cu~1.2mm |
Throwing Power: |
Through hole diameter:≤0.1mm,TP≥120% Blind hole diameter:0.05mm,A/R≤1:1,TP≥90% |
Filling Power: |
Blind hole diameter:0.05mm,A/R≤1:1 Dimple:≤5μm |
Plating Uniformity: |
COV≤5%(Standard Deviation/Avg) Absolute Deviation≤±10% (max-min)/(2*Avg) R≤2.5μm(Cu=12μm) |
Panel Size (Rigid Panel): |
Panel width:Regular Panel width470-622mm(Fixed width dimensions within any range) Panel Length:520-622mm,625-725mm Panel Thickness:0.05mm(core)+12/12μm Cu~2.4mm |
Throwing Power(DC): |
Through-hole diameter: Blind hole diameter: |
Filling Power: |
Blind hole diameter: 0.075mm,A/R 1:1 Dimple:≤10μm |
Plating Uniformity: |
COV≤5%(Standard Deviation/Avg) Absolute Deviation≤±10% (max-min)/(2*Avg) R≤5μm(Cu=25μm) |
Panel Size (Substrate Panel): |
Panel width*Panel Length:410*510,510*515,510*610mm Panel Thickness:0.04mm(core)+3/3μm Cu~1.2mm |
Throwing Power: |
Panel Thickness:≤0.1mm,TP 120% Through-hole diameter:0.1mm,A/R≤8:1 TP≥90% |
Filling Power: |
Blind hole diameter:0.05mm,A/R 1:1 Dimple:≤4μm |
Plating Uniformity: |
COV≤5%(Standard Deviation/Avg) Absolute Deviation≤8% (max-min)/(2*Avg) R≤3μm(Cu=20μm) |
Specification and capability are subject to contract, and machine should work with proper chemicals and current density
Application: First plating, Full panel plating, Half VIA Fill plating,VIA Fill plating, mSAP plating,FPC plating