• Non-contacting Automatic Precision Vertical Continuous Plating Equipment

Non-contacting Automatic Precision Vertical Continuous Plating Equipment

Capability

Panel Size(FPC):

Panel width:250mm*2(Pcs)/500mm

Panel Length:350-500mm

Panel Thickness:0.012mm(core)+12/12μm Cu~1.2mm

Throwing Power:

Through hole diameter:≤0.1mm,TP≥120%

Blind hole diameter:0.05mm,A/R≤1:1,TP≥90%

Filling Power:

Blind hole diameter:0.05mm,A/R≤1:1

Dimple:≤5μm

Plating Uniformity:

COV≤5%(Standard Deviation/Avg)

Absolute Deviation≤±10%

(max-min)/(2*Avg)

R≤2.5μm(Cu=12μm)

Panel Size (Rigid Panel):

Panel width:Regular Panel width470-622mm(Fixed width dimensions within any range)

Panel Length:520-622mm,625-725mm

Panel Thickness:0.05mm(core)+12/12μm Cu~2.4mm

Throwing Power(DC):

Through-hole diameter:
0.15mm,A/R≤8:1. TP≥90%
0.2mm,A/R≤10:1. TP≥85%

Blind hole diameter: 
0.075mm,A/R≤1:1. TP≥90%

Filling Power:

Blind hole diameter: 0.075mm,A/R 1:1

Dimple:≤10μm

Plating Uniformity:

COV≤5%(Standard Deviation/Avg)

Absolute Deviation≤±10%

(max-min)/(2*Avg)

R≤5μm(Cu=25μm)

Panel Size
(Substrate Panel):

Panel width*Panel Length:410*510,510*515,510*610mm

Panel Thickness:0.04mm(core)+3/3μm Cu~1.2mm

Throwing Power:

Panel Thickness:≤0.1mm,TP 120%

Through-hole diameter:0.1mm,A/R≤8:1 TP≥90%

Filling Power:

Blind hole diameter:0.05mm,A/R 1:1

Dimple:≤4μm

Plating Uniformity:

COV≤5%(Standard Deviation/Avg)

Absolute Deviation≤8%

(max-min)/(2*Avg)

R≤3μm(Cu=20μm)

 

Specification and capability are subject to contract, and machine should work with proper chemicals and current density

Non-contacting Automatic Precision Vertical Continuous Plating Equipment

Application: First plating, Full panel plating, Half VIA Fill plating,VIA Fill plating, mSAP plating,FPC plating