• Horizontal VIA Fill Plating Equipment

Horizontal VIA Fill Plating Equipment

Capability

Panel Size: Max: 540*622mm,622*724mm; Min: 406*460mm
Panel Thickness:0.1-2.4mm,0.3-5.5mm
Throwing Power: Blind hole diameter:3-6mil,A/R ≤1:1

Specification and capability are subject to contract, and machine should work with proper chemicals and current density