Panel Size(FPC): | Max: 500mmW*500mmL; Min: 250mmW*250mmL Panel Thickness: 0.025mm(core)+12/12μm Cu~1.2mm |
Panel Size (Rigid Panel): |
Max: 622mmW*725mmL; Min: 355mmW*355mmL Panel Thickness: 0.05mm(core)+12/12μm Cu~3.2mm |
panel Size (Oversized Rigid Panel): |
Max: 725mmW*1250mmL; Min: 406mmW*457mmL Panel Thickness: 0.05mm(core)+12/12μm Cu~3.2mm |
Panel Size (Back Panel): |
Max: 622mmW*725mmL; Min: 355mmW* 355mmL Panel Thickness: 0.5~12mm |
Specification and capability are subject to contract,and machine should work with proper chemicals.
UCE and Chemitron Inc. are long-term strategic partners who jointly own the Hyper Etching invention patent. We are committed to innovating the latest cutting-edge technology for PCB wet-process equipment to meet the ever-changing needs of the industry.
1. Suitable for fine line circuits
2. Suitable for thick copper etching
3. Enhances the etching factor
4. Reduce etching residual copper and improve yield