• DES Machine  (Hyper Etching)

DES Machine (Hyper Etching)

Capability

Panel Size(FPC): Max: 500mmW*500mmL; Min: 250mmW*250mmL
Panel Thickness: 0.025mm(core)+12/12μm Cu~1.2mm
Panel Size
(Rigid Panel):
Max: 622mmW*725mmL; Min: 355mmW*355mmL
Panel Thickness: 0.05mm(core)+12/12μm Cu~3.2mm
panel Size
(Oversized Rigid Panel):
Max: 725mmW*1250mmL; Min: 406mmW*457mmL
Panel Thickness: 0.05mm(core)+12/12μm Cu~3.2mm
Panel Size
(Back Panel):
Max: 622mmW*725mmL; Min: 355mmW* 355mmL
Panel Thickness: 0.5~12mm

 

Specification and capability are subject to contract,and machine should work with proper chemicals.

DES Machine (Hyper Etching)

UCE and Chemitron Inc. are long-term strategic partners who jointly own the Hyper Etching invention patent. We are committed to innovating the latest cutting-edge technology for PCB wet-process equipment to meet the ever-changing needs of the industry.

 

Hyper Etching advantages

1. Suitable for fine line circuits

2. Suitable for thick copper etching

3. Enhances the etching factor

4. Reduce etching residual copper and improve yield