| Panel Size(FPC): | Panel width：250mm*2（Pcs）/500mm Panel Length：350-500mm Panel Thickness：0.012mm(core)+12/12μm Cu~1.2mm |
| Throwing Power： | Through-hole diameter： ≤0.1mm， TP≥120% Blind hole diameter： 0.05mm，A/R≤1:1，TP≥90% |
| Filling Power: | Blind hole diameter： 0.05mm，A/R 1:1 Dimple：≤5μm |
| Plating Uniformity: | COV≤5%(Standard Deviation/Avg) Absolute Deviation≤±12% （max-min）/（2*Avg） R≤2.8μm(Cu=12μm) |
| Panel Size (Rigid Panel): |
Panel width：406-622mm，355-507mm,470-725mm Panel Length：419-622mm，521-725mm Panel Thickness：0.1-4.0mm |
| Throwing Power： | DC： Through-hole diameter： 0.15mm，A/R≤8:1, TP≥90% 0.2mm，A/R≤10:1, TP≥85% Pulse： Through-hole diameter： 0.15mm，A/R≤12:1, TP≥100% 0.2mm，A/R≤20:1, Tp≥90% 0.2mm，A/R≤25:1, TP≥85% Blind hole diameter: 0.075mm，A/R≤1:1，TP≥90% |
| Filling Power: | Blind hole diameter： 0.075mm，A/R≤1:1 Dimple：≤10μm |
| Plating Uniformity: | COV≤5%(Standard Deviation/Avg) Absolute Deviation≤±12%， （max-min）/（2*Avg） R≤6μm(Cu=25μm) |
| Panel Size (Oversized Panel): |
Panel width：585-622mm，690-725mm Panel Length(max)：1092mm/1250mm Panel Thickness: 0.5~3.2mm |
| Throwing Power： | DC： Through-hole diameter： 0.2mm，A/R≤8:1, TP≥90% 0.2mm，A/R≤10:1, TP≥85% Pulse： Through-hole diameter： 0.2mm，A/R≤12:1, TP≥100% 0.2mm，A/R≤16:1, TP≥95% |
| Plating Uniformity: | COV≤5%(Standard Deviation/Avg) Absolute Deviation≤±12%， （max-min）/（2*Avg） R≤6μm(Cu=25μm) |
Specification and capability are subject to contract, and machine should work with proper chemicals and current density
Application: First plating, Full panel plating, Pulse plating,Pattern plating,VIA Fill plating,Half VIA Fill plating,FPC plating
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