• Vertical Continuous Copper Plating Equipment

Vertical Continuous Copper Plating Equipment

Capability

Panel Size(FPC):

Panel width:250mm*2(Pcs)/500mm

Panel Length:350-500mm

Panel Thickness:0.012mm(core)+12/12μm Cu~1.2mm

Throwing Power:

Through-hole diameter:
≤0.1mm, TP≥120%

Blind hole diameter:
0.05mm,A/R≤1:1,TP≥90%

Filling Power:

Blind hole diameter:
0.05mm,A/R 1:1

Dimple:≤5μm

Plating Uniformity:

COV≤5%(Standard Deviation/Avg)

Absolute Deviation≤±12%

(max-min)/(2*Avg)

R≤2.8μm(Cu=12μm)

Panel Size
(Rigid Panel):

Panel width:406-622mm,355-507mm,470-725mm

Panel Length:419-622mm,521-725mm

Panel Thickness:0.1-4.0mm

Throwing Power:

DC:
Through-hole diameter:
0.15mm,A/R≤8:1, TP≥90%
0.2mm,A/R≤10:1, TP≥85%

Pulse:
Through-hole diameter:
0.15mm,A/R≤12:1, TP≥100%
0.2mm,A/R≤20:1, Tp≥90%
0.2mm,A/R≤25:1, TP≥85%

Blind hole diameter:
0.075mm,A/R≤1:1,TP≥90%

Filling Power:

Blind hole diameter:
0.075mm,A/R≤1:1

Dimple:≤10μm

Plating Uniformity:

COV≤5%(Standard Deviation/Avg)

Absolute Deviation≤±12%,

(max-min)/(2*Avg)

R≤6μm(Cu=25μm)

Panel Size
(Oversized Panel):

Panel width:585-622mm,690-725mm

Panel Length(max):1092mm/1250mm

Panel Thickness: 0.5~3.2mm

Throwing Power:

DC:
Through-hole diameter:
0.2mm,A/R≤8:1, TP≥90%
0.2mm,A/R≤10:1, TP≥85%

Pulse:
Through-hole diameter:
0.2mm,A/R≤12:1, TP≥100%
0.2mm,A/R≤16:1, TP≥95%

Plating Uniformity:

COV≤5%(Standard Deviation/Avg)

Absolute Deviation≤±12%,

(max-min)/(2*Avg)

R≤6μm(Cu=25μm)

 

Specification and capability are subject to contract, and machine should work with proper chemicals and current density

Vertical Continuous Copper Plating Equipment

Application: First plating, Full panel plating, Pulse plating,Pattern plating,VIA Fill plating,Half VIA Fill plating,FPC plating